EU RoHS | Compliant |
ECCN (US) | EAR99 |
Part Status | Active |
HTS | 8542.39.00.01 |
Logic Family | LVC |
Logic Function | NAND |
Number of Elements per Chip | 4 |
Number of Element Inputs | 2-IN |
Number of Output Enables per Element | 0 |
Number of Selection Inputs per Element | 0 |
Number of Element Outputs | 1 |
Maximum Propagation Delay Time @ Maximum CL (ns) | [email protected]|[email protected] |
Absolute Propagation Delay Time (ns) | 14 |
Process Technology | CMOS |
Output Type | Push-Pull |
Maximum Low Level Output Current (mA) | 24 |
Maximum High Level Output Current (mA) | -24 |
Minimum Operating Supply Voltage (V) | 1.65 |
Typical Operating Supply Voltage (V) | 3.3|2.5|1.8 |
Maximum Operating Supply Voltage (V) | 3.6 |
Maximum Quiescent Current (uA) | 1 |
Propagation Delay Test Condition (pF) | 50 |
Minimum Operating Temperature (°C) | -40 |
Maximum Operating Temperature (°C) | 125 |
Supplier Temperature Grade | Commercial |
Packaging | Tape and Reel |
Standard Package Name | SOP |
Pin Count | 14 |
Supplier Package | SOIC |
Mounting | Surface Mount |
Package Height | 1.5(Max) |
Package Length | 8.75(Max) |
Package Width | 4(Max) |
PCB changed | 14 |
Lead Shape | Gull-wing |
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